Project Co-funded by the European Union’s Horizon 2020
Project Co-funded by the European Union’s Horizon 2020
27 Oct 2020 |
The paper "PHM features for large circuit boards to be implemented into electric drivetrain applications" was prsented at the ASME InterPACK 2020, the online International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems is the flagship conference of the Electronics and Photonics Packaging Division (EPPD), in technical co-operation with the Japanese Society of Mechanical Engineering (JSME). The conference was organised by ASME, a not-for-profit membership organization that enables collaboration, knowledge sharing, career enrichment, and skills development across all engineering disciplines.
The paper is avalable in the section documents.
This project is supported by the European Commission
“Project co-funded by the EU Research and Innovation programme Horizon2020 (grant agreement No. 824250). The content of this website reflects solely the views of its authors. The European Commission is not liable for any use that may be made of the information contained therein. The EVC1000 consortium members shall have no liability for damages of any kind that may result from the use of these materials”
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